Insulation Related Specifications (HCPL-2731/2730/0731/0730)
8-Pin DIP
(300 Mil) SO-8
Symbol
Value
Value Units
L(101)
7.1
4.9
mm
Parameter
Minimum External Air
Gap (External
Clearance)
Minimum External
Tracking (External
Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
L(102)
7.4
4.8
mm
0.08
0.08
mm
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
CTI
200
200
Volts
Conditions
Measured from input terminals to
output terminals, shortest distance
through air.
Measured from input terminals to
output terminals, shortest distance
path along body.
Through insulation distance, conductor
to conductor, usually the direct
distance between the photoemitter and
photodetector inside the optocoupler
cavity.
DIN IEC 112/ VDE 0303 Part 1
IIIa
IIIa
Material Group DIN VDE 0110
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
(No Derating Required up to 85°C)
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
Peak Forward Input Current
(50% Duty Cycle, 1 ms Pulse Width)
Reverse Input Voltage (Each Channel)
Input Power Dissipation (Each Channel)
Output Current (Each Channel)
Supply Voltage and Output Voltage
(HCPL-2731, HCPL-0731)
(V
CC
- Pin 8-5, V
O
- Pin 7,6-5) -Note 1
Supply Voltage and Output Voltage
(HCPL-2730, HCPL-0730)
(V
CC
- Pin 8-5, V
O
- Pin 7,6-5) -Note 1
Output Power Dissipation (Each Channel) -Note 12
Total Power Dissipation (Each Channel)
Lead Solder Temperature (for Through Hole Devices)
Reflow Temperature Profile
(for SOIC-8 and Option #300)
Symbol
T
S
T
A
I
F(AVG)
I
FPK
V
R
P
I
I
O
V
CC
Min.
-55
-40
Max.
125
85
20
40
5
35
60
18
Units
°C
°C
mA
mA
V
mW
mA
V
-0.5
V
CC
-0.5
7
V
P
O
100
mW
P
T
135
mW
260°C for 10 sec., 1.6 mm below seating plane
See Package Outline Drawings section
1-113
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
