Small Outline SO-8 Package (HCPL-0731/HCPL-0730)
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXX
YWW
5.842 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
1
2
3
0.381 ± 0.076
(0.016 ± 0.003)
1.270 BSG
(0.050)
7°
0.432
(0.017)
5.080 ± 0.127
(0.200 ± 0.005)
45° X
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0.152 ± 0.051
(0.006 ± 0.002)
0.228 ± 0.025
(0.009 ± 0.001)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.305 MIN.
(0.012)
Solder Reflow Temperature Profile (HCPL-073X and Gull Wing Surface Mount Option 300 Parts).
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
Note: Use of nonchlorine activated fluxes is highly recommended.
Regulatory Information
The HCPL-2731/2730 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
1-112
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
