3
Absolute Maximum Ratings
(No Derating Required up to 85°C)
Storage Temperature ................................................. -55°C to +125°C
Operating Temperature ............................................... -40°C to +85°C
Average Input Current - I
F
........................................................ 20 mA
Peak Input Current - I
F
.............................................................. 40 mA
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current - I
F
.............................................. 1.0 A
(≤1
µs
pulse width, 300 pps)
Reverse Input Voltage - V
R
.............................................................. 5 V
Input Power Dissipation ........................................................... 35 mW
Output Current - I
O
(Pin 5) ........................................................ 60 mA
Supply and Output Voltage - V
CC
(Pin 6-4),V
O
(Pin 5-4)
HCPL-M700 ................................................................... -0.5 V to 7 V
HCPL-M701 ................................................................. -0.5 V to 18 V
Output Power Dissipation ....................................................... 100 mW
Infrared and Vapor Phase Reflow Temperature .................. see below
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Recommended Pb-Free IR Profile
t
p
T
p
T
L
TEMPERATURE
T
smax
T
smin
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
t
L
60 to 150 SEC.
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
Insulation Related Specifications
Parameter
Symbol
Min. External Air Gap
L(IO1)
(Clearance)
Min. External Tracking Path
L(IO2)
(Creepage)
Min. Internal Plastic Gap
(Clearance)
Tracking Resistance
CTI
Isolation Group (per DIN VDE 0109)
Value
≥5
≥5
0.08
175
IIIa
Units
mm
mm
mm
V
Conditions
Measured from input terminals
to output terminals
Measured from input terminals
to output terminals
Through insulation distance
conductor to conductor
DIN IEC 112/VDE 0303 Part 1
Material Group DIN VDE 0109
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
