3
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example
HCPL-788J#XXX
No Option = 16-Lead, Surface Mt. package, 45 per tube.
500 = Tape and Reel Packaging Option, 850 per reel.
Option Data sheets available. Contact Hewlett-Packard sales representative, authorized distributor, or visit
our Web site at www.hp.com/go/isolator.
Package Outline Drawings
16-Lead Surface Mount
dimensions in inches
(millimeters)
Note: Initial and continued
variation in the color of the
HCPL-788J’s white mold
compound is normal and does
not affect device performance
or reliability.
0.018
(0.457)
16 15 14 13 12 11 10 9
0.050
(1.270)
TYPE NUMBER
DATE CODE
HP 788J
YYWW
0.295 ± 0.010
(7.493 ± 0.254)
1
2
3
4
5
6
7
8
0.345 ± 0.010
(8.986 ± 0.254)
0.406 ± 0.10
(10.312 ± 0.254)
9°
ALL LEADS
TO BE
COPLANAR
± 0.002
0.018
(0.457)
0.138 ± 0.005
(3.505 ± 0.127)
0–8°
0.025 MIN.
0.408 ± 0.010
(10.160 ± 0.254)
0.008 ± 0.003
(0.203 ± 0.076)
STANDOFF
Package Characteristics
Parameter
Symbol
Input-Output Momentary
V
ISO
Withstand Voltage
Resistance (Input-Output)
R
I-O
Capacitance (Input-Output)
C
I-O
Input IC Junction-to-Case
θjci
Thermal Resistance
Output IC Junction-to-Case
θjco
Thermal Resistance
Min.
3750
Typ.
Max.
Units
Vrms
Ω
pF
°C/W
>10
9
1.3
120
100
Test Conditions
RH < 50%, t = 1
min., T
A
= 25°C
V
I-O
= 500 V
DC
f = 1 MHz
T
A
= 85°C
Fig.
Notes
1,2,3
3
Maximum Solder Reflow Temperature Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
