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HCPL-4504#060E 参数 Datasheet PDF下载

HCPL-4504#060E图片预览
型号: HCPL-4504#060E
PDF下载: 下载PDF文件 查看货源
内容描述: [Logic IC Output Optocoupler, 1-Element, 3750V Isolation, DIP-8]
分类和应用: 输出元件光电
文件页数/大小: 20 页 / 303 K
品牌: AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
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8
Insulation and Safety Related Specifications  
Value  
Parameter  
Symbol  
Units  
Conditions  
HCPL-4504 HCPL-J454 HCPL-0454 HCNW4504  
Minimum External L(101)  
Air Gap (External  
Clearance)  
7.1  
7.4  
4.9  
9.6  
mm Measured from input  
terminals to output  
terminals, shortest  
distance through air.  
Minimum External L(102)  
Tracking (External  
Creepage)  
7.4  
8.0  
4.8  
10.0  
mm Measured from input  
terminals to output  
terminals, shortest  
distance path along  
body.  
Minimum Internal  
Plastic Gap  
(Internal Clearance)  
0.08  
0.5  
0.08  
1.0  
mm Through insulation  
distance, conductor  
to conductor,  
usually the direct  
distance between the  
photoemitter and  
photodetector inside  
the optocoupler  
cavity.  
Minimum Internal  
Tracking (Internal  
Creepage)  
NA  
NA  
NA  
4.0  
mm Measured from input  
terminals to output  
terminals, along  
internal cavity.  
Tracking Resistance CTI  
(Comparative  
175  
175  
175  
200  
Volts DIN IEC 112/VDE  
0303 Part 1  
Tracking Index)  
Isolation Group  
IIIa  
IIIa  
IIIa  
IIIa  
Material Group  
(DIN VDE 0110,  
1/89, Table 1)  
All Agilent data sheets report the  
creepage and clearance inherent  
to the optocoupler component  
itself. These dimensions are  
needed as a starting point for the  
equipment designer when  
ribs which may be used on a  
printed circuit board to achieve  
desired creepage and clearances.  
Creepage and clearance distances  
will also change depending on  
factors such as pollution degree  
and insulation level.  
creepage and clearance  
requirements must be met as  
specified for individual  
equipment standards. For  
creepage, the shortest distance  
path along the surface of a  
printed circuit board between the  
solder fillets of the input and  
output leads must be considered.  
There are recommended  
determining the circuit insulation  
requirements.  
However, once mounted on a  
printed circuit board, minimum  
techniques such as grooves and