The HCPL-070L and HCPL-073L
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The SOIC-8 does not require
"through holes" in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-270L #XXX
060 = VDE 0884 V
IORM
= 630 V
peak
Option
500 = Tape and Reel Packaging Option
Option data sheets available. Contact your Agilent sales representative
or authorized distributor for information.
Selection Guide
8-Pin DIP (300 Mil)
Single Channel
Dual Channel
Package HCPL-
Package HCPL-
270L
273L
Small Outline SO-8
Single Channel
Dual Channel
Package HCPL-
Package HCPL-
070L
073L
Minimum Input
ON Current (I
F
)
0.5 mA
1.6 mA
Minimum CTR
400%
300%
Schematic
1
+
V
F1
I
F1
I
CC
8
V
CC
V
CC
8
I
CC
2
ANODE
+
V
F
CATHODE
–
3
I
O
6
V
O
I
F
–
2
I
O1
V
O1
7
3
–
V
F2
I
F2
I
O2
6
V
O2
+
4
5
SHIELD
GND
SHIELD
GND
5
I
B
7
VB
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED
HCPL-270L/HCPL-070L
HCPL-273L/HCPL-073L
2
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
