Package Outline Drawings
HCPL-181-000E
2.54
±
0.25
3.60
±
0.3
5.30
±
0.3
181
Y WW
LEAD
FREE
DATE CODE *1
4.40
±
0.2
2.00
±
0.2
0.2
±
0.05
0.40
±
0.1
RANK *2
0.10
±
0.1
7.00
+ 0.2
– 0.7
DIMENSIONS IN MILLIMETERS.
HCPL-181-060E
2.54
±
0.25
3.60
±
0.3
5.30
±
0.3
181 V
Y WW
LEAD
FREE
DATE CODE *1
4.40
±
0.2
2.00
±
0.2
0.2
±
0.05
0.40
±
0.1
RANK *2
0.10
±
0.1
+ 0.2
7.00 – 0.7
DIMENSIONS IN MILLIMETERS.
Temperature (°C)
Solder Reflow Temperature Profile
1) One-time soldering reflow is
recommended within the
condition of temperature and
time profile shown at right.
2) When using another soldering
method such as infrared ray
lamp, the temperature may rise
partially in the mold of the
device. Keep the temperature on
the package of the device within
the condition of (1) above.
30 seconds
250°C
217°C
200°C
260°C (Peak Temperature)
150°C
60 sec
25°C
60 ~ 150 sec
90 sec
Time (sec)
60 sec
2
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
