3
Package Outline Drawings
Surface Mount Small-Outline SOIC-8 Package
8
7
6
5
5.994 ± 0.203
(0.236 ± 0.008)
XXX
3.937 ± 0.127
(0.155 ± 0.005)
YWW
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
1
2
3
4
PIN ONE
0.406 ± 0.076
(0.016 ± 0.003)
1.270
(0.050)
BSG
0.432
(0.017)
*
7°
5.080 ± 0.127
(0.200 ± 0.005)
45° X
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
*
0.305
(0.012)
MIN.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
Solder Reflow Temperature Profile
260
240
220
∆T = 145°C, 1°C/SEC
∆T = 115°C, 0.3°C/SEC
200
180
160
140
120
100
80
∆T = 100°C, 1.5°C/SEC
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS HIGHLY RECOMMENDED.)
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
