6
Insulation and Safety Related Specifications
8-Pin DIP
(300 Mil)
Value
7.1
SO-8
Value
4.9
Parameter
Minimum External
Air Gap (External
Clearance)
Minimum External
Tracking (External
Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Minimum Internal
Tracking (Internal
Creepage)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
Symbol
L(101)
L(102)
7.4
4.8
Units
Conditions
mm Measured from input terminals to output to
to output terminals, shortest distance through
air.
mm Measured from input terminals to output
terminals, shortest distance path along body.
mm
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
Measured from input terminals to output
terminals, along internal cavity.
DIN IEC 112/VDE 0303 Part 1
0.08
0.08
NA
NA
mm
CTI
200
200
Volts
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
(each channel)
Peak Forward Input Current (each channel)
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current (each channel)
(≤ 1
µs
pulse width, 300 pps)
Reverse LED Input Voltage (each channel)
Input Power Dissipation (each channel)
Average Output Current (each channel)
Peak Output Current
Supply Voltage (Pin 8-5)
Output Voltage (Pins 7-5, 6-5)
Output Power Dissipation (each channel)
Lead Solder Temperature
(Through-Hole Parts Only)
1.6 mm below seating plane, 10 seconds
Reflow Temperature Profile
Symbol
T
S
T
A
I
F(AVG)
I
F(PEAK)
I
F(TRANS)
V
R
P
IN
I
O(AVG)
I
O(PEAK)
V
CC
V
O
P
O
Device
Min.
-55
-55
Max.
125
100
25
50
1
5
45
8
16
30
20
35
Units
°C
°C
mA
mA
A
V
mW
mA
mA
V
V
mW
Note
-0.5
-0.5
13
T
LS
T
RP
8 Pin DIP
SO-8 and
Option 300
260
°C
See
Package Outline
Drawings
section
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