8
Absolute Maximum Ratings
Parameter
Storage Temperature*
Operating Temperature*
Symbol
T
S
T
A
Device
8-Pin DIP
SO-8
Widebody
8-Pin DIP
SO-8
Widebody
8-Pin DIP
SO-8
Widebody
8-Pin DIP
SO-8
Widebody
8-Pin DIP
SO-8
Widebody
Min.
-55
-55
-55
Max.
125
100
85
25
50
40
1
0.1
5
3
45
40
8
16
5
-0.5
-0.5
-0.5
-0.5
30
20
15
15
5
100
Units
°C
°C
Note
Average Forward Input Current*
Peak Forward Input Current*
(50% duty cycle, 1 ms pulse width)
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current*
(≤ 1
µs
pulse width, 300 pps)
Reverse LED Input Voltage* (Pin 3-2)
I
F(AVG)
I
F(PEAK)
mA
mA
A
1
2
I
F(TRANS)
V
R
V
Input Power Dissipation*
P
IN
mW
3
Average Output Current* (Pin 6)
Peak Output Current*
Emitter-Base Reverse Voltage*
(Pin 5-7, except 4502/3, 0452/3)
Supply Voltage (Pin 8-5)
Output Voltage (Pin 6-5)
Supply Voltage* (Pin 8-5)
Output Voltage* (Pin 6-5)
Base Current* (Pin 7, except 4502/3, 0452/3)
Output Power Dissipation*
Lead Solder Temperature*
(Through-Hole Parts Only)
1.6 mm below seating plane, 10 seconds
up to seating plane, 10 seconds
Reflow Temperature Profile
*Data has been registered with JEDEC for the 6N135/6N136.
I
O(AVG)
I
O(PEAK)
V
EBR
V
CC
V
O
V
CC
V
O
I
B
P
O
mA
mA
V
V
V
V
V
mA
mW
4
T
LS
T
RP
8-Pin DIP
Widebody
SO-8 and
Option 300
260
°C
260
°C
See
Package Outline
Drawings
section
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
