2
The 6N139, HCPL-0701, and
CNW139 are for use in CMOS,
LSTTL or other low power appli-
cations. A 400% minimum current
transfer ratio is guaranteed over
0 to 70°C operating range for only
0.5 mA of LED current.
The 6N138, HCPL-0700, and
HCNW138 are designed for use
mainly in TTL applications.
Current Transfer Ratio (CTR) is
300% minimum over 0 to 70°C
for an LED current of 1.6 mA
(1 TTL Unit load ). A 300%
minimum CTR enables operation
with 1 TTL Load using a 2.2 kΩ
pull-up resistor.
Selection for lower input current
down to 250
µA
is available upon
request.
The HCPL-0701 and HCPL-0700
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The SOIC-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
The HCNW139 and HCNW138
are packaged in a widebody
encapsulation that provides creep-
age and clearance dimensions
suitable for safety approval by
regulatory agencies worldwide.
Selection Guide
8-Pin DIP
(300 Mil)
Single
Channel
Package
6N139
6N138
HCPL-4701
[1]
Dual
Channel
Package
HCPL-
2731
[1]
2730
[1]
4731
[1]
Widebody
Package
(400 mil)
Single
Channel
Package
HCNW139
HCNW138
Minimum
Input ON
Current
(I
F
)
0.5 mA
1.6 mA
40
µA
0.5 mA
Absolute
Maxi-
mum
V
CC
18 V
7V
18 V
20 V
5701
[1]
5700
[1]
5731
[1]
5730
[1]
Hermetic
Single and
Dual
Channel
Packages
HCPL-
Small Outline SO-8
Single
Dual
Channel
Channel
Package
Package
HCPL-
HCPL-
0701
0700
070A
[1]
0731
0730
073A
[1]
Minimum
CTR
400%
300%
800%
300%
Note:
1. Technical data are on separate HP publications.
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
