Recommended Land Pattern for AEDR-8300 Series
0.72
Mounting Center
0.94
1.96
Note: The shaded areas are not
encoder pin-outs. They are
electrically grounded and
Note: The shaded areas
are the leads for soldering.
1.08
physically exposed. PCB layout
with tracks running across
these areas should be avoided.
Recommended Lead-free Reflow Soldering Temperature Profile
300
10 - 20 sec
255°C
250°C
250
217°C
200
120 sec max
60 - 150 sec
150
125°C
100
50
0
40°C
TIME (sec.)
Heat up
Solder Paste Dry
Solder Reflow
Cool Down
Preheat Temperature 40°C to 125°C = 120 sec max
Temperature maintain above 217°C = 60-150 sec
Peak Temperature = 255 ± 5°C
Time above 250°C = 10-20 sec
Note: Due to treatment of high
temperature, AEDR-8300 trans-
parent compound is expected to
turn yellow after IR reflow.
9
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