Alloy type
Sn42Bi58
Sn43Pb43Bi14
Sn63Pb37
Sn60Pb40
Sn91/Zn9
Sn96.2Ag2.5Cu0.8Sb0.5
Sn95.8Ag3.5Cu0.7
Sn96.5Ag3.5
Sn100
Sn95Sb5
Sn97Cu3
Melting temp. (
o
C)
138
144 – 163
183
186
199
216
217
221
232
235
240
Recommended working
temperature (
o
C)
160 – 180
165 – 185
200 – 240
200 – 240
200 – 240
235 – 255
235 – 255
240 – 260
260 – 280
260 – 280
260 – 300
Comments
Lead free
Contains lead – some customers prohibit it
Contains lead – some customers prohibit it
Contains lead – some customers prohibit it
May have oxidation problems
Popular lead free composition
Other alloy ratios are available
Used in the assembly of filters
Too hot – will melt package assembly
Too hot – will melt package assembly
Too hot – will melt package assembly
10 to 20 sec.
250
217°C
200
235°C
±
5°C
125°C
±
25°C
60 to 120 sec.
Temperature,
°C
150
-6°C/sec. max
3°C/sec. max
100
120 sec. max.
50
Guidelines
Tested profile
0
0
100
200
300
400
500
600
Time, seconds
Figure 11. Recommended solder profile.
www.agilent.com/semiconductors
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distributors, please go to our web site.
For technical assistance call:
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Data subject to change.
Copyright © 2003 Agilent Technologies, Inc.
Obsoletes 5988-6276EN
March 20, 2003
5988-8531EN
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
