4.0
3.0
BOTTOM VIEW
2.0
1.0
Green is area covered by solder mask
Gold is contact pad
Gray is exposed PCB material
Black is filled via holes
All dimensions in mm
Tolerance is ±0.1mm
Pin assignments are shown in red
Tx
3.2
1.8
1.0
Rx
2.7
3.1
4.8 5.0
1.9
0.6
2.3
Ant
0.2
0.6
1.9
2.3
2.7
3.1
4.4
4.8
5.0
0.2
SIDE VIEW
1.4 max.
5.0
Figure 19. Outline drawing.
Solder Compositions
Shaded line is the alloy type recommended by Agilent Technologies.
Alloy type
Sn42Bi58
Sn43Pb43Bi14
Sn63Pb37
Sn60Pb40
Sn91/Zn9
Sn96.2Ag2.5Cu0.8Sb0.5
Sn95.8Ag3.5Cu0.7
Sn96.5Ag3.5
300
Melting temp.
(
o
C)
138
144 – 163
183
186
199
216
217
221
Recommended working
temperature (
o
C)
160 – 180
165 – 185
200 – 240
200 – 240
TEMPERATURE (°C)
250
200
150
100
50
200 – 240
235 – 255
235 – 255
240 – 260
0
0
50
100
150
TIME (seconds)
Tested profile shown.
200
250
300
Figure 20. Recommended Solder Profile.
9
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
