Solder Reflow Temperature Profile
30 seconds
1) One-time soldering reflow is
recommended within the
260°C (Peak Temperature)
250°C
217°C
condition of temperature and
time profile shown at right.
200°C
150°C
2) When using another soldering
method such as infrared ray
lamp, the temperature may rise
partially in the mold of the
60 sec
25°C
device. Keep the temperature on
the package of the device within
the condition of (1) above.
60 ~ 150 sec
90 sec
Time (sec)
60 sec
Absolute Maximum Ratings
Storage Temperature, T
–55˚C to +150˚C
–55˚C to +100˚C
260˚C for 10 s
S
Operating Temperature, T
A
Lead Solder Temperature, max.
(1.6 mm below seating plane)
Average Forward Current, I
60 mA
6 V
F
Reverse Input Voltage, V
R
Input Power Dissipation, P
100 mW
100 mA
30 V
I
Collector Current, I
C
Collector-Emitter Voltage, V
Emitter-Collector Voltage, V
CEO
ECO
7 V
Collector-Base Voltage, V
70 V
CBO
Collector Power Dissipation
Total Power Dissipation
300 mW
350 mW
3550 Vrms
Isolation Voltage, V (AC for 1 minute, R.H. = 40 ~ 60%)
iso
3
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