Temperature (°C)
Solder Reflow Temperature Profile
1) One-time soldering reflow is
recommended within the
condition of temperature and
time profile shown at right.
2) When using another soldering
method such as infrared ray
lamp, the temperature may rise
partially in the mold of the
device. Keep the temperature on
the package of the device within
the condition of (1) above.
30 seconds
250°C
217°C
200°C
260°C (Peak Temperature)
150°C
60 sec
25°C
60 ~ 150 sec
90 sec
Time (sec)
60 sec
Absolute Maximum Ratings
Storage Temperature, T
S
Operating Temperature, T
A
Lead Solder Temperature, max.
(1.6 mm below seating plane)
Average Forward Current, I
F
Reverse Input Voltage, V
R
Input Power Dissipation, P
I
Collector Current, I
C
Collector-Emitter Voltage, V
CEO
Emitter-Collector Voltage, V
ECO
Collector-Base Voltage, V
CBO
Collector Power Dissipation
Total Power Dissipation
Isolation Voltage, V
iso
(AC for 1 minute, R.H. = 40 ~ 60%)
–55˚C to +150˚C
–55˚C to +100˚C
260˚C for 10 s
80 mA
6V
150 mW
100 mA
30 V
7V
70 V
150 mW
250 mW
2500 Vrms
3
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