Data Sheet
June 1999
ORCA Series 3C and 3T FPGAs
O. xH routing segments from the adjacent PLC routing.
Programmable Input/Output Cells
(continued)
P. BIDI routing segments from the adjacent PLC rout-
ing.
PIC Architectural Description
Q. These are the IN2 routing segments. There is one
IN2 line from each PIO, and all eight IN2 lines from
each PIC pair are present in both PICs of a pair.
The PIC architecture as seen in ORCA Foundry is
shown in Figure 27. The figure is the left PIC of a PIC
pair on the top edge of a Series 3 array. Both PICs in a
pair are similar, with the differences mainly lying in the
connections between the PIC switching segments
(pSW), the IN2 connections across PIC boundaries,
and the system clock spine driver residing in only one
PIC of a pair.
R. These CIPs connect the IN1 and IN2 routing seg-
ments from the PIOs to the PIC switching seg-
ments.
S. These CIPs break the PIC switching segments at
the interface between a PIC pair.
T. These CIPs connect adjacent PLC routing
A. This is a programmable input/output (PIO). There
are four PIOs per PIC. The PIOs contain the PIC
logic and I/O buffers.
resources to the PIC switching segments.
U. These CIPs connect inter-PIC routing with the PIC
switching segments.
B. This is the PIC output switching block. It connects
the PIC switching segments and local clock lines to
the PIO output and control signals.
V. These CIPs break the px1, px2, and px5 routing at
the middle of a PIC. The px2 and px5 CIP place-
ment varies depending on the PLC.
C. This is the system clock spine switching block and
buffer. There is only one system clock spine per pair
of PICs. Its inputs can come from the PIC switching
segments or any of the eight PIO inputs in a PIC
pair.
W. These mutually exclusive buffers can drive one long
line signal onto a PIC local clock routing segment.
X. These mutually exclusive buffers can select a
source from one of the local system clock routes to
drive the PIO 3-state control signal.
D. PIC switching segments (pSW). These routing seg-
ments are used to interconnect routing resources
within the PIC and to a lesser degree, between
PICs.
Y. These are the four local system clock routing seg-
ments. Two come from connections within the PIC,
one from the other PIC in the pair, and one from the
adjacent PLC.
E. px1 routing segments. The PIC x1 routing seg-
ments traverse one PIC and break at a CIP in the
middle of each PIC.
Z. These mutually exclusive buffers allow a signal on
the PIC switching segments to be routed to a sys-
tem clock spine or to a PIO system clock.
F. px2 routing segments. The PICs have routing that
traverses two PICs between breaks. The breaks are
staggered among the five px2 segments.
AA. ExpressCLK routing line.
AB. System clock spine.
G. px5 routing segments. Each of the ten PIC x5 rout-
ing segments traverses five PICs in between breaks
at a CIP. Two px5 segments break in each PIC.
AC. These various groups of CIPs connect routing
resources from the adjacent PLC to the inter-PIC
routing resources.
H. pxH routing segments. The eight PIC xH routing
segments traverse half of the array and break at
CIPs in the interquad routing region that is in the
middle of the array.
AD. These buffers provide connectivity between the
PLC xL (xH) lines and the PIC xL (xH) lines or
connectivity between one of the IN2 routing seg-
ments and the PIC and/or PLC xL (xH) routing
segments.
I. (Not used intentionally for clarity.)
J. pxL routing segments. The PIC long lines run the
AE. These mutually exclusive buffers and CIPs provide
connectivity to the PLC xL and xH lines from one
of the IN2 input segments.
entire length of the side of the array.
K. x5 routing segments from the adjacent PLC routing.
L. xL routing segments from the adjacent PLC routing.
M. x1 routing segments from the adjacent PLC routing.
N. Switching segments from the adjacent PLC routing.
AF. These buffers allow the IN2 signals to drive onto
the BIDI routing of the adjacent PLC, or the BIDI
routing of the adjacent PLC, and the PIC switching
segments and/or PIC half lines may be connected.
Lucent Technologies Inc.
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