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BTF1A 参数 Datasheet PDF下载

BTF1A图片预览
型号: BTF1A
PDF下载: 下载PDF文件 查看货源
内容描述: 双差分收发器BTF1A闲置客车指标 [Dual Differential Transceiver BTF1A With Idle Bus Indicator]
分类和应用:
文件页数/大小: 16 页 / 236 K
品牌: AGERE [ AGERE SYSTEMS ]
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Dual Differential Transceiver BTF1A  
With Idle Bus Indicator  
Data Sheet  
March 2001  
The power dissipated in the output is a function of the:  
Termination scheme on the outputs  
Termination resistors  
Power Dissipation  
System designers incorporating Lucent data transmis-  
sion drivers in their applications should be aware of  
package and thermal information associated with these  
components.  
Duty cycle of the output  
Package thermal impedance depends on:  
Airflow  
Proper thermal management is essential to the long-  
term reliability of any plastic encapsulated integrated  
circuit. Thermal management is especially important  
for surface-mount devices, given the increasing circuit  
pack density and resulting higher thermal density. A  
key aspect of thermal management involves the junc-  
tion temperature (silicon temperature) of the integrated  
circuit.  
Package type (e.g., DIP, SOIC, SOIC/NB)  
The junction temperature can be calculated using the  
previous equation, after power dissipation levels and  
package thermal impedances are known.  
Figure 16 illustrates the thermal impedance estimates  
for the various package types as a function of airflow.  
This figure shows that package thermal impedance is  
higher for the narrow-body SOIC package. Particular  
attention should, therefore, be paid to the thermal man-  
agement issues when using this package type.  
Several factors contribute to the resulting junction tem-  
perature of an integrated circuit:  
Ambient use temperature  
Device power dissipation  
In general, system designers should attempt to main-  
tain junction temperature below 125 °C. The following  
factors should be used to determine if specific data  
transmission drivers in particular package types meet  
the system reliability objectives:  
Component placement on the board  
Thermal properties of the board  
Thermal impedance of the package  
Thermal impedance of the package is referred to as  
System ambient temperature  
Power dissipation  
Package type  
Θ
ja and is measured in °C rise in junction temperature  
per watt of power dissipation. Thermal impedance is  
also a function of airflow present in system application.  
The following equation can be used to estimate the  
junction temperature of any device:  
Airflow  
Tj = TA + PD  
Θ
ja  
140  
130  
where:  
Tj is device junction temperature (°C).  
TA is ambient temperature (°C).  
PD is power dissipation (W).  
120  
110  
100  
90  
SOIC/NB  
Θ
ja is package thermal impedance (junction to  
ambient°C/W).  
80  
70  
J-LEAD SOIC/GULL WING  
The power dissipation estimate is derived from two fac-  
tors:  
60  
50  
40  
DIP  
Internal device power  
0
200  
400  
600  
800  
1000 1200  
Power associated with output terminations  
AIRFLOW (ft/min)  
12-2753(F)  
Multiplying ICC times VCC provides an estimate of  
internal power dissipation.  
Figure 16. Power Dissipation  
Agere Systems Inc.  
15