Table II – Normal Operating Conditions (Continued)
(T
C
= +25
°
C unless otherwise specified)
PARAMETERS
SWITCHING CHARACTERISTICS
Upper Drive:
Turn-on propagation delay
Turn-off propagation delay
Shut-down propagation delay
Turn-on Transition Time
Turn-off Transition Time
Lower Drive:
Turn-on propagation delay
Turn-off propagation delay
Shut-down propagation delay
Turn-on Transition Time
Turn-off Transition Time
SWITCHING ENERGY LOSSES (At I = 40A, V = 480V)
Turn-on Energy
Turn-off Energy
DEAD TIME
THERMAL
Junction-Case Thermal Resistance (IGBT)
Junction-Case Thermal Resistance (DIODE)
Maximum Lead Soldering Temp
Junction Temperature Range
Case Operating Temperature
Case Storage Temperature
NOTES:
1. Pulse width
≤
300 usec duty cycle
≤
2%
2. V+ = 480 V, Inputs = logic "1"
3. Solder 1/8" from case for 5 seconds maximum
θ
jcIGBT
θ
jcDIODE
E
on
E
off
SYMBOL
TEST
CONDITIONS
MIN
TYP
MAX
UNIT
t
d
(on)
t
d
(off)
t
SDU
t
r
t
f
700
2
3.5
100
250
nsec
µsec
µsec
nsec
nsec
t
d
(on)
t
d
(off)
t
SDL
t
r
t
f
T
c
= +125
°
C
600
2
3.5
250
200
nsec
µsec
µsec
nsec
nsec
4
6
500
mJ
mJ
nsec
t
dt
each transistor
each diode
See Note 3
-55
-55
-55
.45
.85
250
150
125
150
°
C/W
°
C/W
°
C
°
C
°
C
°
C
T
S
T
J
T
C
T
cs
Aeroflex Circuit Technology
4
SCD5101-1 REV D 5/14/01 Plainview NY (516) 694-6700
AEROFLEX [ AEROFLEX CIRCUIT TECHNOLOGY ]
