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5962F9689103QXX 参数 Datasheet PDF下载

5962F9689103QXX图片预览
型号: 5962F9689103QXX
PDF下载: 下载PDF文件 查看货源
内容描述: 抗辐射32K ×8 PROM [Radiation-Hardened 32K x 8 PROM]
分类和应用: 内存集成电路LORA可编程只读存储器
文件页数/大小: 11 页 / 71 K
品牌: AEROFLEX [ AEROFLEX CIRCUIT TECHNOLOGY ]
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DEVICE OPERATION  
PIN NAMES  
The UT28F256 has three control inputs: Chip Enable (CE),  
Program Enable (PE), and Output Enable (OE); fifteen address  
inputs, A(14:0); and eight bidirectional data lines, DQ(7:0).CE  
is the device enable input that controls chip selection, active, and  
standby modes. AssertingCE causes I DD to rise to its active value  
A(14:0)  
CE  
Address  
Chip Enable  
OE  
Output Enable  
Program Enable  
Data Input/Data Output  
and decodes the fifteen address inputs to select one of 32,768  
words in the memory. PE controls program and read operations.  
During a read cycle, OE must be asserted to enable the outputs.  
PE  
DQ(7:0)  
PIN CONFIGURATION  
Table 1. Device Operation Truth Table 1  
1
A14  
A12  
A7  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
V
DD  
OE  
X
0
PE  
1
CE  
1
I/O MODE  
Three-state  
Data Out  
Data In  
MODE  
Standby  
Read  
2
PE  
A13  
A8  
3
A6  
A5  
4
1
0
5
A9  
1
0
0
Program  
A4  
A3  
A2  
6
A11  
2
1
1
0
Three-state  
7
OE  
Read  
8
A10  
Notes:  
A1  
A0  
9
CE  
1. “X” is defined as a “don’t care” condition.  
2. Device active; outputs disabled.  
10  
11  
12  
13  
14  
DQ7  
DQ6  
DQ0  
DQ1  
DQ2  
DQ5  
DQ4  
V
DQ3  
SS  
ABSOLUTE MAXIMUM RATINGS 1  
(Referenced to VSS  
SYMBOL  
VDD  
)
PARAMETER  
LIMITS  
UNITS  
DC supply voltage  
-0.3 to 7.0  
V
V
VI/O  
TSTG  
PD  
Voltage on any pin  
-0.5 to (VDD + 0.5)  
Storage temperature  
-65 to +150  
1.5  
°C  
Maximum power dissipation  
Maximum junction temperature  
W
TJ  
+175  
°C  
Thermal resistance, junction-to-case 2  
DC input current  
QJC  
II  
3.3  
°C/W  
mA  
±10  
Notes:  
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the  
device at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
2. Test per MIL-STD-883, Method 1012, infinite heat sink.  
2