AMS2931
ELECTRICAL CHARACTERISTICS
Electrical Characteristics at VIN =14V, VOUT =3V IO =10mA, TJ=25°C, R1 =27k, C2 = 100mF unless otherwise specified.
AMS2931C
PARAMETER
CONDITIONS
Units
(Note 2)
Min.
Max.
Typ.
Adjustable Version
Reference Voltage
1.14
1.20
1.26
V
V
IO £ 100 mA, -40°C £T £ 125°C, R1=27k,
J
1.08
1.32
Measured from VOUT to Adjust Pin
Output Voltage Range
Line Regulation
3
24
.02
0.3
V
1.5
1
mV/V
%
VOUT + 0.6V £V £ 26V
IN
Load Regulation
Dropout Voltage
5mA £I £ 100 mA
O
I
I
£ 10 mA
0.05
0.3
0.2
0.6
V
V
O
O
= 100 mA
Quiescent Current
I
I
= 10 mA
0.4
15
mA
mA
mA
1
1
O
O
= 100 mA
0.8
During Shutdown RL = 500W
10Hz-100kHz
Output Noise Voltage
Output Impedance
Long Term Stability
Ripple Rejection
100
40
mVrms/V
mW
100mADC and 10mArms,100Hz=10kHz
T =1000hr
0.4
0.02
33
%/1000hr
%/V
fO = 120Hz
Maximum Operational Input
Voltage
26
60
V
Maximum Line Transient
70
V
IO = 10mA, Reference Voltage £ 1.5V
T = 1ms, t £100ms
Reverse Polarity Input Voltage,
D/C
-15
-50
-30
-80
V
V
RL = 500W, VO ³ -0.3V
RL = 500W, T = 1ms, t £100ms
VO = 3V
Reverse Polarity Input Voltage,
Transient
On/Off Threshold Voltage
On
2.0
2.2
20
1.2
50
V
V
Off
3.25
On/Off Threshold Current
mA
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test conditions, see
the Electrical Characteristics tables.
Note 2: See Circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for
TA = TJ = 25°C.
Note 4: The junction-to-ambient thermal resistance are as follows: 195°C/W for the TO-92 (N) package, 160°C/W for the molded plastic SO-8 (S), 50°C/W for the
TO-220 package and 73°C/W for the TO-263 package. If the TO-220 package is used with a heat sink, qJA is the sum of the package thermal resistance junction-to-
case of 3°C/W and the thermal resistance added by the heat sink and the thermal interface. The thermal resistance of the TO-263 package can be reduced by
increasing the PCB copper area thermally connected to the package: using 0.5 square inches of copper area, j JA is 50°C/W; with 1 square inch of copper area j JA is
37°C/W; and with 1.6 or more square inches of copper area j JA is 32°C/W.
Advanced Monolithic Systems, Inc. 6680B Sierra Lane, Dublin, CA 94568 Phone (925) 556-9090 Fax (925) 556-9140