OP275
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±22 V
Input Voltage
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±22 V
Differential Input Voltage
2
. . . . . . . . . . . . . . . . . . . . . . . ±7.5 V
Output Short-Circuit Duration to GND
3
. . . . . . . . . . Indefinite
Storage Temperature Range
P, S Packages . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range
OP275G . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature Range
P, S Packages . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . . . .300°C
Package Type
8-Lead Plastic DIP (P)
8-Lead SOIC (S)
JA4
103
158
JC
43
43
Unit
°C/W
°C/W
NOTES
1
Absolute maximum ratings apply to packaged parts, unless otherwise noted.
2
For supply voltages greater than ±22 V, the absolute maximum input voltage is equal
to the supply voltage.
3
Shorts to either supply may destroy the device. See data sheet for full details.
4
JA
is specified for the worst-case conditions, i.e.,
JA
is specified for device in socket
for PDIP packages;
JA
is specified for device soldered in circuit board for SOIC
packages.
ORDERING GUIDE
Model
OP275GP
OP275GS
OP275GS-REEL
OP275GS-REEL7
OP275GSZ*
OP275GSZ-REEL*
OP275GSZ-REEL7*
*Z
= Pb-free part.
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
8-Lead PDIP
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
Package Option
N-8
R-8
R-8
R-8
R-8
R-8
R-8
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily accumulate
on the human body and test equipment and can discharge without detection. Although the OP275 features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
REV. C
–3–