ADN8830
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . GND to V
S
+ 0.3 V
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range . . . . . . . . . . . . –40°C to +85°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . 125°C
Lead Temperature Range (Soldering, 10 sec) . . . . . . . . 300°C
ESD RATINGS
Package Type
32-Lead LFCSP (ACP)
JA
*
JC
Unit
°C/W
35
10
*
JA
is specified for worst-case conditions, i.e.,
JA
is specified for a device
soldered in a 4-layer circuit board for surface-mount packages.
883 (Human Body) Model . . . . . . . . . . . . . . . . . . . . . . 1.0 kV
*Stresses
above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Model
ADN8830ACP
ADN8830ACP-REEL
ADN8830ACP-REEL7
ADN8830-EVAL
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
Evaluation Board
Package Option
CP-32-1
CP-32-1
CP-32-1
PIN CONFIGURATION
32 NC
31 TEMPOUT
30 AGND
29 PHASE
28 SYNCOUT
27 SOFTSTART
26 FREQ
25 SYNCIN
THERMFAULT 1
THERMIN 2
SD
3
TEMPSET 4
TEMPLOCK 5
NC 6
VREF 7
AVDD 8
PIN 1
INDICATOR
ADN8830
TOP VIEW
24 COMPOSC
23 PGND
22 N1
21 P1
20 PVDD
19 OUT A
18 COMPSWIN
17 COMPSWOUT
NC = NO CONNECT
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADN8830 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. C
OUT B 9
N2 10
P2 11
TEMPCTL 12
COMPFB 13
COMPOUT 14
VLIM 15
VTEC 16
–3–
AD [ ANALOG DEVICES ]
