Data Sheet
HMC856
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND
I+
I–
1
2
3
4
5
6
7
8
24 GND
23 O+
22
O–
HMC856
21 GND
GND
GND
B0+
B0–
NC
TOP VIEW
(Not to Scale)
20
19
GND
B4+
18 B4–
17 NC
PACKAGE
BASE
V
EE
NOTES
1. NC = NO CONNECT.
2. NIC = NOT INTERNALLY CONNECTED.
3. EXPOSED PAD. THE EXPOSED PAD MUST
BE CONNECTED TO THE NEGATIVE
VOLTAGE SUPPLY.
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin Number
1, 4, 5, 11, 14, 20, 21, 24
2, 3
Mnemonic
Description
GND
I+, I−
Signal Ground.
Differential Data Inputs. CML referenced to positive supply.
6, 7, 9, 10, 12, 13, 15, 16, B0+, B0−, B1+, B1−, B2+, B2−,
Differential Digital Control Inputs. CML referenced to positive supply.
18, 19
B3+, B3−, B4−, B4+
8, 17
NC
No Connect. These pins are internally connected to the device. These pins can
be connected to radio frequency (RF)/dc ground without affecting performance.
25, 32
NIC
Not Internally Connected. These pins can be connected to radio frequency
(RF)/dc ground without affecting performance.
22, 23
26, 31
27, 30
O−, O+
GND
VEE
Differential Data Outputs. CML referenced to positive supply, 50 Ω termination.
Supply Ground.
Negative Supply Voltage. These pins and the exposed pad must be connected
to the negative voltage supply.
28
29
VR
Output Level Control. Output levels can be increased or decreased by
applying voltage to VR, as shown in Figure 12.
DC Bias Voltage. VB must be connected to ground.
VB
EPAD (VEE)
Exposed Pad. The exposed pad must be connected to the negative voltage supply.
Rev. D | Page 5 of 13
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