DAC08
TYPICAL ELECTRICAL CHARACTERISTICS
characteristics apply to both I
OUT
and
I
OUT
.)
Parameter
Reference Input Slew Rate
Propagation Delay
Settling Time
Symbol
dI/dt
t
PLH
, t
PHL
t
S
Conditions
T
A
= 25°C, Any Bit
To +1/2 LSB, All Bits
Switched ON or OFF,
T
A
= 25°C
All Grades
Typical
8
35
85
Units
mA/µs
ns
ns
(@ V
S
=
15 V, and I
REF
= 2.0 mA, unless otherwise noted. Output
NOTES
For DAC08NT & GT 25°C characteristics, see DAC08N & G characteristics respectively.
Specifications subject to change without notice
ABSOLUTE MAXIMUM RATINGS
1
PIN CONNECTIONS
16-Pin Dual-In-Line Package
(Q Suffix)
Operating Temperature
DAC08AQ, Q . . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C
DAC08HQ, EQ, CQ, HP, EP, CP, CS . . . . . 0°C to +70°C
Junction Temperature (T
J
) . . . . . . . . . . . . . . –65°C to +150°C
Storage Temperature Q Package . . . . . . . . . . –65°C to +150°C
Storage Temperature P Package . . . . . . . . . . –65°C to +125°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . . 300°C
V+ Supply to V– Supply . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . V– to V– plus 36 V
V
LC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V– to V+
Analog Current Outputs (at V
S
– = 15 V) . . . . . . . . . . 4.25 mA
Reference Input (V
14
to V
15
) . . . . . . . . . . . . . . . . . . . V– to V+
Reference Input Differential Voltage
(V
14
to V
15
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
18 V
Reference Input Current (I
14
) . . . . . . . . . . . . . . . . . . . 5.0 mA
Package Type
16-Pin Hermetic DIP (Q)
16-Pin Plastic DIP (P)
20-Contact LCC (RC)
16-Pin SO (S)
JA
2
JC
16-Lead SO
(S Suffix)
Units
°C/W
°C/W
°C/W
°C/W
100
82
76
111
16
39
36
35
NOTES
1
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
θ
JA
is specified for worst case mounting conditions, i.e.,
θ
JA
is specified for device
in socket for cerdip, P-DIP, and LCC packages;
θ
JA
is specified for device soldered
to printed circuit board for SO package.
DAC08RC/883 20-Lead LCC
(RC Suffix)
ORDERING GUIDE
1
16-Pin Dual-In-Line Package
NL
0.1%
0.19%
0.39%
Hermetic
DAC08AQ
2
DAC08HQ
DAC08Q
2
DAC08EQ
DAC08CQ
Plastic
DAC08HP
DAC08RC/883
DAC08EP
DAC08CP
DAC08CS
3
LCC
Operating
Temperature
Range
MIL
COM
MIL
COM
COM
COM
NC = NO CONNECT
NOTES
1
Burn-in is available on commercial and industrial temperature range parts in
cerdip, plastic DIP, and TO-can packages.
2
For devices processed in total compliance to MIL-STD-883, add /883 after
part number. Consult factory for 883 data sheet.
3
For availability and burn-in information on SO and PLCC packages, contact
your local sales office.
REV. A
–3–
AD [ ANALOG DEVICES ]
