ADSP-BF542/ADSP-BF544/ADSP-BF547/ADSP-BF548/ADSP-BF549
OUTLINE DIMENSIONS
Dimensions for the 17 mm × 17 mm CSP_BGA package in
Figure 87 are shown in millimeters.
15.20 BSC SQ
17.00 BSC SQ
A1 BALL INDICATOR
A1 BALL
0.80 BSC BALL PITCH
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
20 19 18 17 16 1514 13 12 11 10
9 8 7 6 5 4 3 2 1
BOTTOM VIEW
TOP VIEW
0.28 MIN
0.12 MAX
COPLANARITY
SIDE VIEW
1.70 MAX
0.50
0.45
0.40
SEATING PLANE
BALL DIAMETER
DETAIL A
DETAIL A
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIANT TO JEDEC REGISTERED OUTLINE MO-205, VARIATION AM,
WITH THE EXCEPTION OF BALL DIAMETER.
3. CENTER DIMENSIONS ARE NOMINAL.
Figure 87. 400-Ball, 17 mm × 17 mm CSP_BGA (Chip Scale Package Ball Grid Array) (BC-400-1)
SURFACE-MOUNT DESIGN
Table 67 is provided as an aid to PCB design. For industry-stan-
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 67. BGA Data for Use with Surface-Mount Design
Package
Ball Attach Type
400-Ball CSP_BGA (Chip Scale Package Ball Grid Array) BC-400-1 Solder Mask Defined
Package
Solder Mask Opening
0.40 mm Diameter
Package
Ball Pad Size
0.50 mm Diameter
Package
Rev. C
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Page 98 of 100
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February 2010
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