ADSP-BF531/ADSP-BF532
Thermal resistance θJA in Table 30 through Table 32 is the figure
of merit relating to performance of the package and board in a
convective environment. θJMA represents the thermal resistance
under two conditions of airflow. ΨJT represents the correlation
between TJ and TCASE
Table 30. Thermal Characteristics for BC-160 Package
Parameter Condition Typical Unit
.
θJA
0 Linear m/s Airflow
27.1
23.85
22.7
7.26
0.14
0.26
0.35
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
θJMA
θJMA
θJC
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
ΨJT
ΨJT
ΨJT
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Table 31. Thermal Characteristics for ST-176-1 Package
Parameter Condition Typical Unit
θJA
0 Linear m/s Airflow
34.9
33.0
32.0
0.50
0.75
1.00
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
θJMA
θJMA
ΨJT
ΨJT
ΨJT
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Table 32. Thermal Characteristics for B-169 Package
Parameter Condition Typical Unit
θJA
0 Linear m/s Airflow
22.8
20.3
19.3
10.39
0.59
0.88
1.37
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
θJMA
θJMA
θJC
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
ΨJT
ΨJT
ΨJT
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Rev. D
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Page 49 of 60
|
August 2006
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