ADSP-BF531/ADSP-BF532/ADSP-BF533
ORDERING GUIDE
Temperature Speed Grade Operating Voltage
Range
1
(Max)
(Nom)
Package Description
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array
(PBGA)
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array
(PBGA)
–40°C to +85°C 400 MHz
1.2 V internal,
160-Ball Chip Scale Package
1.8 V, 2.5 V or 3.3 V I/O
Ball Grid Array (CSP_BGA)
–40°C to +85°C 400 MHz
1.2 V internal,
160-Ball Chip Scale Package
1.8 V, 2.5 V or 3.3 V I/O
Ball Grid Array (CSP_BGA)
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack
(LQFP)
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack
(LQFP)
–40°C to +85°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
160-Ball Chip Scale Package
Ball Grid Array (CSP_BGA)
–40°C to +85°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
169-Ball Plastic Ball Grid Array
(PBGA)
–40°C to +85°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
176-Lead Quad Flatpack
(LQFP)
–40°C to +105°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
160-Ball Chip Scale Package
Ball Grid Array (CSP_BGA)
–40°C to +105°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
169-Ball Plastic Ball Grid Array
(PBGA)
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array
(PBGA)
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array
(PBGA)
–40°C to +85°C 400 MHz
1.2 V internal,
160-Ball Chip Scale Package
1.8 V, 2.5 V or 3.3 V I/O
Ball Grid Array (CSP_BGA)
–40°C to +85°C 400 MHz
1.2 V internal,
160-Ball Chip Scale Package
1.8 V, 2.5 V or 3.3 V I/O
Ball Grid Array (CSP_BGA)
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack
(LQFP)
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack
(LQFP)
–40°C to +85°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
160-Ball Chip Scale Package
Ball Grid Array (CSP_BGA)
–40°C to +85°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
169-Ball Plastic Ball Grid Array
(PBGA)
–40°C to +85°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
176-Lead Quad Flatpack
(LQFP)
–40°C to +105°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
160-Ball Chip Scale Package
Ball Grid Array (CSP_BGA)
–40°C to +105°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
169-Ball Plastic Ball Grid Array
(PBGA)
Package
Option
B-169
B-169
BC-160-2
BC-160-2
ST-176-1
ST-176-1
BC-160-2
B-169
ST-176-1
BC-160-2
B-169
B-169
B-169
BC-160-2
BC-160-2
ST-176-1
ST-176-1
BC-160-2
B-169
ST-176-1
BC-160-2
B-169
Model
ADSP-BF531SBB400
ADSP-BF531SBBZ400
ADSP-BF531SBBC400
ADSP-BF531SBBCZ400
2
ADSP-BF531SBST400
ADSP-BF531SBSTZ400
2
ADSP-BF531WBBCZ-4A
2,3
ADSP-BF531WBBZ-4A
2,3
ADSP-BF531WBSTZ-4A
2,3
ADSP-BF531WYBCZ-4A
2,3
ADSP-BF531WYBZ-4A
2,3
ADSP-BF532SBB400
ADSP-BF532SBBZ400
2
ADSP-BF532SBBC400
ADSP-BF532SBBCZ400
2
ADSP-BF532SBST400
ADSP-BF532SBSTZ400
ADSP-BF532WBBCZ-4A
2
ADSP-BF532WBBZ-4A
2,3
ADSP-BF532WBSTZ-4A
2,3
ADSP-BF532WYBCZ-4A
2,3
ADSP-BF532WYBZ-4A
2,3
Rev. E |
Page 59 of 60 |
July 2007
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