ADSP-BF531/ADSP-BF532/ADSP-BF533
SURFACE-MOUNT DESIGN
Table 47 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface-Mount Design and Land Pat-
tern Standard.
Table 47. BGA Data for Use with Surface-Mount Design
Package
Ball Attach Type
Solder Mask Opening
0.40 mm diameter
0.43 mm diameter
Ball Pad Size
Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-2
Plastic Ball Grid Array (PBGA) B-169
Solder Mask Defined
Solder Mask Defined
0.55 mm diameter
0.56 mm diameter
Rev. I
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Page 61 of 64
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August 2013
ADI [ ADI ]
