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ADSP-BF532_15 参数 Datasheet PDF下载

ADSP-BF532_15图片预览
型号: ADSP-BF532_15
PDF下载: 下载PDF文件 查看货源
内容描述: [Blackfin Embedded Processor]
分类和应用:
文件页数/大小: 64 页 / 2449 K
品牌: ADI [ ADI ]
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ADSP-BF531/ADSP-BF532/ADSP-BF533  
Table 38. Thermal Characteristics for BC-160 Package  
THERMAL CHARACTERISTICS  
To determine the junction temperature on the application  
printed circuit board, use:  
Parameter Condition  
Typical Unit  
JA  
0 Linear m/s Airflow  
27.1  
23.85  
22.7  
7.26  
0.14  
0.26  
0.35  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
TJ = TCASE + JT PD  
JMA  
JMA  
JC  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Not Applicable  
where:  
TJ = Junction temperature (°C).  
T
CASE = Case temperature (°C) measured by customer at top  
JT  
JT  
JT  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
center of package.  
JT = From Table 38 through Table 40.  
PD = Power dissipation (see the power dissipation discussion  
and the tables on 23 for the method to calculate PD).  
Table 39. Thermal Characteristics for ST-176-1 Package  
Parameter Condition Typical Unit  
Values of JA are provided for package comparison and printed  
circuit board design considerations. JA can be used for a first  
order approximation of TJ by the equation:  
JA  
0 Linear m/s Airflow  
34.9  
33.0  
32.0  
0.50  
0.75  
1.00  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
TJ = TA + JA PD  
JMA  
JMA  
JT  
JT  
JT  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
where:  
TA = ambient temperature (°C).  
In Table 38 through Table 40, airflow measurements comply  
with JEDEC standards JESD51–2 and JESD51–6, and the junc-  
tion-to-board measurement complies with JESD51–8. The  
junction-to-case measurement complies with MIL-STD-883  
(Method 1012.1). All measurements use a 2S2P JEDEC test  
board.  
Table 40. Thermal Characteristics for B-169 Package  
Parameter Condition Typical Unit  
JA  
0 Linear m/s Airflow  
22.8  
20.3  
19.3  
10.39  
0.59  
0.88  
1.37  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
Thermal resistance JA in Table 38 through Table 40 is the figure  
of merit relating to performance of the package and board in a  
convective environment. JMA represents the thermal resistance  
under two conditions of airflow. JT represents the correlation  
JMA  
JMA  
JC  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Not Applicable  
between TJ and TCASE  
.
JT  
JT  
JT  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Rev. I  
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Page 49 of 64  
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August 2013  
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