ADP3338
•
•
Use the adjacent area to the ADP3338 to add more copper
around it. Connecting the copper area to the output of the
ADP3338, as shown in Figure 22 (c), is best, but thermal
performance will be improved even if it is connected to
other signals.
Use the following general guidelines when designing printed
circuit boards:
•
•
•
Keep the output capacitor as close as possible to the output
and ground pins.
Keep the input capacitor as close as possible to the input
and ground pins.
Use additional copper layers or planes to reduce the
thermal resistance. Again, connecting the other layers to
the output of the ADP3338 is best, but is not necessary.
When connecting the output pad to other layers, use
multiple vias.
Specify thick copper and use wide traces for optimum heat
transfer. PC board traces with larger cross sectional areas
remove more heat from the ADP3338.
•
Decrease thermal resistance by adding a copper pad under
the ADP3338, as shown in Figure 22 (b).
Rev. B | Page 11 of 16
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