55
ASMꢃ2ꢃ2ꢀ
OUTLINꢀ5SIMꢀNEIONE5
10.00 (0.3937)
9.80 (0.3858)
9
8
16
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
1.27 (0.0500)
BSC
0.50 (0.0197)
0.25 (0.0098)
45°
1.75 (0.0689)
1.35 (0.0531)
0.25 (0.0098)
0.10 (0.0039)
8°
0°
COPLANARITY
0.10
SEATING
PLANE
1.27 (0.0500)
0.40 (0.0157)
0.51 (0.0201)
0.31 (0.0122)
0.25 (0.0098)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-AC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 13. 16-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(RN-16)
Dimensions shown in millimeters (and inches)
5.10
5.00
4.90
16
9
8
4.50
4.40
4.30
6.40
BSC
1
PIN 1
1.20
MAX
0.15
0.05
0.20
0.09
0.75
0.60
0.45
8°
0°
0.30
0.19
0.65
BSC
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 14. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADM3232EARNZ1
ADM3232EARNZ-REEL71
ADM3232EARUZ1
ADM3232EARUZ-REEL71
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
16-Lead SOIC_N
16-Lead SOIC_N
16-Lead TSSOP
Package Option
RN-16
RN-16
RU-16
RU-16
16-Lead TSSOP
1 Z = Pb-free part.
Rev. 0 | Page 9 of 12
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