ADM3202/ADM3222/ADM1385
S1
V
CC
C1
S2
GND
INTERNAL
OSCILLATOR
+
S4
V
CC
C3
+
S3
V+ = 2V
CC
Receiver Section
Figure 9. Charge Pump Voltage Doubler
S1
FROM
VOLTAGE
DOUBLER
V
+
C2
S2
+
S4
V– = –(V+)
C4
+
S3
GND
The receivers are inverting level-shifters that accept RS-232
input levels and translate them into 3 V logic output levels.
The inputs have internal 5 kΩ pull-down resistors to ground and
are also protected against overvoltages of up to
±
30 V. Uncon-
nected inputs are pulled to 0 V by the internal 5 kΩ pull-down
resistor. This, therefore, results in a Logic 1 output level for
unconnected inputs or for inputs connected to GND.
The receivers have Schmitt trigger inputs with a hysteresis level
of 0.4 V. This ensures error-free reception for both noisy inputs
and for inputs with slow transition times.
HIGH BAUD RATE
GND
INTERNAL
OSCILLATOR
Figure 10. Charge Pump Voltage Inverter
Transmitter (Driver) Section
The drivers convert 3.3 V logic input levels into RS-232 output
levels. With V
CC
= +3.3 V and driving an RS-232 load, the
output voltage swing is typically
±
6 V.
The ADM3202E/ADM3222E feature high slew rates permitting
data transmission at rates well in excess of the EIA/RS-232E
specifications. RS-232 voltage levels are maintained at data rates
up to 460 kbps even under worst case loading conditions. This
allows for high speed data links between two terminals or indeed
it is suitable for the new generation I
SDN
modem standards which
requires data rates of 230 kbps. The slew rate is internally con-
trolled to less than 30 V/µs in order to minimize EMI interference.
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
16-Lead Plastic DIP
(N-16)
0.840 (21.34)
0.745 (18.92)
16
1
9
8
16-Lead Narrow Body SOIC
(R-16A)
0.3937 (10.00)
0.3859 (9.80)
0.280 (7.11)
0.240 (6.10)
0.060 (1.52)
0.015 (0.38)
0.130
(3.30)
MIN
PIN 1
0.210 (5.33)
MAX
0.160 (4.06)
0.115 (2.93)
0.022 (0.558)
0.014 (0.356)
0.100
(2.54)
BSC
0.325 (8.26)
0.300 (7.62) 0.195 (4.95)
0.115 (2.93)
0.1574 (4.00)
0.1497 (3.80)
1
16
9
8
0.2440 (6.20)
0.2284 (5.80)
PIN 1
0.0098 (0.25)
0.0040 (0.10)
0.0688 (1.75)
0.0532 (1.35)
0.0196 (0.50)
x 45
0.0099 (0.25)
0.070 (1.77) SEATING
0.045 (1.15) PLANE
0.015 (0.381)
0.008 (0.204)
0.0500
SEATING (1.27)
PLANE BSC
0.0192 (0.49)
0.0138 (0.35)
8
0.0099 (0.25) 0
0.0075 (0.19)
0.0500 (1.27)
0.0160 (0.41)
16-Lead Thin Shrink Small Outline (TSSOP)
(RU-16)
0.201 (5.10)
0.193 (4.90)
16
9
16-Lead Wide Body SOIC
(R-16)
0.4133 (10.50)
0.3977 (10.00)
16
9
1
8
1
8
PIN 1
0.006 (0.15)
0.002 (0.05)
0.0433
(1.10)
MAX
0.0118 (0.30)
0.0075 (0.19)
PIN 1
0.0118 (0.30)
0.0040 (0.10)
8°
0°
0.028 (0.70)
0.020 (0.50)
0.1043 (2.65)
0.0926 (2.35)
0.4193 (10.65)
0.3937 (10.00)
0.2992 (7.60)
0.2914 (7.40)
0.177 (4.50)
0.169 (4.30)
0.256 (6.50)
0.246 (6.25)
0.0291 (0.74)
x 45
0.0098 (0.25)
0.0256
SEATING (0.65)
PLANE BSC
0.0079 (0.20)
0.0035 (0.090)
0.0500
(1.27)
BSC
0.0192 (0.49)
SEATING
0.0138 (0.35) PLANE
0.0125 (0.32)
0.0091 (0.23)
8
0
0.0500 (1.27)
0.0157 (0.40)
REV. A
–7–
AD [ ANALOG DEVICES ]
