24-Lead Cerdip (Q-24)
24
PIN 1
1
1.290 (32.77) MAX
0.225
(5.715)
MAX
0.125
(3.175)
MIN
0.180
(4.572)
MAX
SEATING
PLANE
0.021 (0.533) 0.110 (2.794)
0.015 (0.381) 0.090 (2.286)
0
°
TYP
TYP
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH.
2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
0.070 (1.778)
0.065 (1.651) 0.020 (0.508)
0.055 (1.397)
TYP
15
°
0.012 (0.305)
0.008 (0.203)
TYP
12
0.320 (8.128)
0.290 (7.366)
13
0.295 (7.493)
MAX
28-Lead SOIC (R-28)
28
15
0.299 (7.6)
0.291 (7.39)
PIN 1
1
14
0.708 (18.02)
0.696 (17.67)
0.096 (2.44)
0.089 (2.26)
0.03 (0.76)
0.02 (0.51)
0.01 (0.254)
0.006 (0.15)
0.05 (1.27)
BSC
0.019 (0.49)
0.014 (0.35)
0.013 (0.32)
0.009 (0.23)
6
°
0
°
0.042 (1.067)
0.018 (0.457)
1. LEAD NO. IDENTIFIED BY A DOT.
2. SOICLEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead SOIC (R-24)
28-Lead SSOP (RS-28)
24
13
0.299 (7.6)
0.291 (7.39)
0.414 (10.52)
0.398 (10.10)
28
15
0.212 (5.38)
0.205 (5.207)
0.311 (7.9)
0.301 (7.64)
PIN 1
1
12
PIN 1
1
14
0.608 (15.45)
0.596 (15.13)
0.096 (2.44)
0.089 (2.26)
0.03 (0.76)
0.02 (0.51)
0.407 (10.34)
0.397 (10.08)
0.07 (1.78)
0.066 (1.67)
0.01 (0.254)
0.006 (0.15)
0.05 (1.27)
BSC
0.019 (0.49)
0.014 (0.35)
0.013 (0.32)
0.009 (0.23)
6
°
0
°
0.042 (1.067)
0.018 (0.447)
0.008 (0.203)
0.002 (0.050)
0.0256 (0.65)
BSC
0.009 (0.229)
0.005 (0.127)
8
°
0
°
0.037 (0.94)
0.022 (0.559)
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
–16–
PRINTED IN U.S.A.
C1900–18–4/94
0.414 (10.52)
0.398 (10.10)
AD [ ANALOG DEVICES ]
