24-Lead Cer dip (Q -24)
28-Lead SO IC (R-28)
13
24
1
PIN 1
0.295 (7.493)
MAX
28
1
15
0.299 (7.6)
12
0.291 (7.39)
0.320 (8.128)
0.290 (7.366)
1.290 (32.77) MAX
0.414 (10.52)
0.398 (10.10)
PIN 1
0.180
(4.572)
MAX
0.225
(5.715)
MAX
14
SEATING
PLANE
0.125
(3.175)
MIN
0.096 (2.44)
0.012 (0.305)
0.708 (18.02)
0.696 (17.67)
0.089 (2.26)
0.070 (1.778)
0.020 (0.508)
15
°
0.110 (2.794)
0.021 (0.533)
0.015 (0.381)
TYP
0.008 (0.203)
TYP
0.065 (1.651)
0.03 (0.76)
0.02 (0.51)
0.090 (2.286)
TYP
0.055 (1.397)
TYP
0°
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH.
0.042 (1.067)
0.018 (0.457)
2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
6
0
°
°
0.01 (0.254)
0.006 (0.15)
0.019 (0.49)
0.014 (0.35)
0.05 (1.27)
BSC
0.013 (0.32)
0.009 (0.23)
1. LEAD NO. IDENTIFIED BY A DOT.
2. SOICLEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead SO IC (R-24)
28-Lead SSO P (RS-28)
24
13
28
15
0.299 (7.6)
0.212 (5.38)
0.205 (5.207)
0.291 (7.39)
0.414 (10.52)
0.311 (7.9)
0.301 (7.64)
PIN 1
0.398 (10.10)
12
PIN 1
1
1
14
0.096 (2.44)
0.608 (15.45)
0.07 (1.78)
0.066 (1.67)
0.089 (2.26)
0.407 (10.34)
0.397 (10.08)
0.596 (15.13)
0.03 (0.76)
0.02 (0.51)
0.037 (0.94)
0.022 (0.559)
8
0
°
°
0.042 (1.067)
0.018 (0.447)
6°
0°
0.008 (0.203)
0.002 (0.050)
0.01 (0.254)
0.006 (0.15)
0.0256 (0.65)
BSC
0.05 (1.27)
BSC
0.019 (0.49)
0.014 (0.35)
0.009 (0.229)
0.005 (0.127)
0.013 (0.32)
0.009 (0.23)
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
–16–
ADI [ ADI ]
