ADM231L–ADM234L/ADM236L–ADM241L
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
Parameter
Rating
VCC
V+
V–
–0.3 V to +6 V
(VCC – 0.3 V) to +14 V
+0.3 V to −14 V
Q-14 CERDIP (Derate 10 mW/°C 720 mW
above 70°C)
Q-16 CERDIP (Derate 10 mW/°C 800 mW
above 70•C)
Input Voltages
TIN
RIN
Output Voltages
TOUT
ROUT
Short-Circuit Duration
TOUT
Power Dissipation
N-14 PDIP (Derate 10 mW/°C
above 70°C)
N-16 PDIP (Derate 10.5 mW/°C
above 70°C)
N-20 PDIP (Derate 11 mW/°C
above 70°C)
N-24-1 PDIP (Derate
Q-24 CERDIP (Derate
1000 mW
–0.3 V to (VCC + 0.3 V)
30 V
12.5 mW/°C above 70°C)
Thermal Impedance, θJA
N-14 PDIP
N-16 PDIP
N-20 PDIP
N-24-1 PDIP
140°C/W
135°C/W
125°C/W
120°C/W
105°C/W
85°C/W
(V+, +0.3 V) to (V–, –0.3 V)
–0.3 V to (VCC + 0.3 V)
Continuous
R-16 SOIC
R-24 SOIC
800 mW
840 mW
890 mW
1000 mW
760 mW
850 mW
R-28 SOIC
80°C/W
RS-28 SSOP
Q-14 CERDIP
Q-16 CERDIP
Q-24 CERDIP
100°C/W
105°C/W
100°C/W
55°C/W
Operating Temperature Range
Commercial (J Version)
Industrial (A Version)
Storage Temperature Range
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
13.5 mW/°C above 70°C)
0°C to 70°C
−40°C to +85°C
−65°C to +150°C
300°C
215°C
220° C
R-16 SOIC (Derate 9 mW/°C
above 70°C)
R-24 SOIC (Derate 12 mW/°C
above 70°C)
R-28 SOIC (Derate 12.5 mW/°C 900 mW
above 70°C)
RS-28 SSOP (Derate 10 mW/°C
above 70°C)
900 mW
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods of
time may affect device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 4 of 20
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