ADM206–ADM211/ADM213
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Rtresses above those listed under Absolute Maximum ꢀatings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods of
time may affect device reliability.
Parameter
Min
VCC
V+
V–
–0.3 V to +6 V
(VCC – 0.3 V) to +14 V
+0.3 V to –14 V
Input Voltages
TIN
RIN
–0.3 V to (VCC + 0.3 V)
30 V
Output Voltages
TOUT
ROUT
(V+, +0.3 V) to (V–, –0.3 V)
–0.3 V to (VCC + 0.3 V)
Short-Circuit Duration
TOUT
Continuous
Power Dissipation
N-24 PDIP (Derate 13.5 mW/°C
above 70°C)
R-24 SOIC (Derate 12 mW/°C
above 70°C)
R-28 SOIC (Derate 12.5 mW/°C
above 70°C)
RS-24 SSOP (Derate 12 mW/°C
above 70°C)
1000 mW
850 mW
900 mW
850 mW
900 mW
RS-28 SSOP (Derate 10 mW/°C
above 70°C)
Thermal Impedance, θJA
N-24 PDIP
R-24 SOIC
R-28 SOIC
RS-24 SSOP
120°C/W
85°C/W
80°C/W
115°C/W
100°C/W
RS-28 SSOP
Operating Temperature Range
Industrial (A Version)
Storage Temperature Range
Lead Temperature, Soldering
Vapor Phase (60 s)
Infrared (15 s)
–40°C to +85°C
–65°C to +150°C
300°C
215°C
220°
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 4 of 16
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