ADG506A/ADG507A
TERMINOLOGY
tOFF (EN)
Delay time between the 50% and 10% points of
the digital input and switch “OFF” condition
RON
Ohmic resistance between terminals D and S
R
ON Match Difference between the RON of any two channels
tTRANSITION Delay time between the 50% and 90% points of
the digital inputs and switch “ON” condition
when switching from one address state to
another
RON Drift
IS (OFF)
Change in RON versus temperature
Source terminal leakage current when the switch
is off
ID (OFF)
Drain terminal leakage current when the switch
is off
tOPEN
“OFF” time measured between 50% points of
both switches when switching from one address
state to another
Maximum input voltage for Logic “0”
Minimum input voltage for Logic “1”
Input current of the digital input
Most positive voltage supply
Most negative voltage supply
Positive supply current
Negative supply current
I
D (ON)
Leakage current that flows from the closed switch
into the body
VINL
VINH
IINL (IINH
VDD
VS (VD)
CS (OFF)
CD (OFF)
CIN
Analog voltage on terminal S or D
Channel input capacitance for “OFF” condition
Channel output capacitance for “OFF” condition
Digital input capacitance
)
VSS
IDD
ISS
t
ON (EN)
Delay time between the 50% and 90% points of
the digital input and switch “ON” condition
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
28-Lead Cerdip (Suffix Q)
28-Lead Plastic DIP (Suffix N)
1.490 (37.84) MAX
0.550 (13.97)
0.53 (13.47)
0.525 (13.33)
0.515 (13.08)
1.45(36.83)
1.44 (36.58)
0.16 (4.07)
0.14 (3.56)
0.18(4.57)
MAX
0.606 (15.4)
0.594 (15.09)
0.62 (15.74)
0.59 (14.93)
GLASS
SEALANT
0.06 (1.52)
0.05 (1.27)
0.22 (5.59)
MAX
0.2
(5.08)
MAX
0.125
(3.175)
MIN
15؇
0
0.012 (0.305)
0.008 (0.203)
0.065 (1.66)
0.045 (1.15)
0.105 (2.67)
0.095 (2.42)
0.020 (0.508)
0.015 (0.381)
0.175 (4.45)
0.12 (3.05)
0.012 (0.305)
0.008 (0.203)
0.11 (2.79)
0.099 (2.28)
0.02 (0.5)
0.016 (0.406)
15°
0°
LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH
LEADS ARE SOLDER OR TIN PLATED KOVAR OR ALLOY 42
LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH
LEADS ARE SOLDER OR TIN PLATED KOVAR OR ALLOY 42
28-Lead SOIC (Suffix R)
28-Lead TSSOP (Suffix RU)
0.386 (9.80)
0.378 (9.60)
0.7125 (18.10)
0.6969 (17.70)
28
15
14
28
15
14
1
1
PIN 1
0.006 (0.15)
0.002 (0.05)
PIN 1
0.1043 (2.65)
0.0926 (2.35)
0.0291 (0.74)
x 45°
0.0098 (0.25)
0.0433
(1.10)
MAX
0.028 (0.70)
0.020 (0.50)
8°
0°
0.0500 (1.27)
0.0157 (0.40)
8°
0°
0.0256 (0.65)
BSC
0.0118 (0.30)
0.0075 (0.19)
0.0500
(1.27)
BSC
0.0192 (0.49)
0.0138 (0.35)
0.0118 (0.30)
0.0040 (0.10)
SEATING
PLANE
0.0079 (0.20)
0.0035 (0.090)
SEATING
PLANE
0.0125 (0.32)
0.0091 (0.23)
28-Terminal Leadless Ceramic Chip Carrier (Suffix E)
28-Terminal Plastic Leaded Chip Carrier (Suffix P)
0.300 (7.62)
4
26
25
BSC
0.075
(1.91)
REF
0.050 ؎0.005
01.27 ؎0.13
5
0.100 (2.54)
0.064 (1.63)
PIN 1
IDENTIFIER
0.150
(3.51)
BSC
0.015 (0.38)
MIN
0.021 (0.533)
0.013 (0.331)
0.430 (10.5)
0.390 (9.9)
TOP VIEW
(PINS DOWN)
0.095 (2.41)
0.075 (1.90)
4
26
2
5
28
5
0.032 (0.812)
0.026 (0.661)
0.028 (0.71)
0.022 (0.56)
0.458 (11.63)
0.442 (11.23)
SQ
1
11
12
19
18
0.458
(11.63)
MAX
0.011 (0.28)
0.007 (0.18)
R TYP
BOTTOM
VIEW
0.120 (3.04)
0.090 (2.29)
0.456 (11.582)
0.450 (11.430)
0.050
(1.27)
BSC
SQ
SQ
SQ
0.498 (12.57)
0.485 (12.32)
0.075
(1.91)
REF
12
19
18
0.180 (4.51)
0.165 (4.20)
11
45° TYP
0.200
(5.08)
BSC
0.055 (1.40)
0.045 (1.14)
0.088 (2.24)
0.054 (1.37)
–8–
REV. C
ADI [ ADI ]
