ADG406/ADG407/ADG426
10.50
10.20
9.90
15
28
5.60
5.30
5.00
8.20
7.80
7.40
1
14
0.25
0.09
1.85
1.75
1.65
2.00 MAX
0.05 MIN
8°
4°
0°
0.95
0.75
0.55
0.38
0.22
SEATING
PLANE
COPLANARITY
0.10
0.65 BSC
COMPLIANT TO JEDEC STANDARDS MO-150-AH
Figure 39. 28-Lead Shrink Small Outline Package [SSOP]
(RS-28)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
28-Lead PDIP
28-Lead PDIP
28-Lead PLCC
28-Lead PLCC
28-Lead PLCC
28-Lead PLCC
28-Lead PDIP
28-Lead PDIP
28-Lead PLCC
28-Lead PLCC
28-Lead PLCC
28-Lead PLCC
Package Option2
ADG406BN
ADG406BNZ
ADG406BP
ADG406BP-REEL
ADG406BPZ
ADG406BPZ-REEL
ADG407BN
ADG407BNZ
ADG407BP
ADG407BP-REEL
ADG407BPZ
ADG407BPZ-RL
ADG407BCHIPS
ADG426BN
ADG426BNZ
ADG426BRS
N-28-2
N-28-2
P-28
P-28
P-28
P-28
N-28-2
N-28-2
P-28
P-28
P-28
P-28
DIE
28-Lead PDIP
28-Lead PDIP
28-Lead SSOP
28-Lead SSOP
28-Lead SSOP
28-Lead SSOP
28-Lead SSOP
N-28-2
N-28-2
RS-28
RS-28
RS-28
RS-28
RS-28
ADG426BRS-REEL
ADG426BRS-REEL7
ADG426BRSZ
ADG426BRSZ-REEL
1 Z = RoHS Compliant Part.
2 N = Plastic DIP, P = Plastic Leaded Chip Carrier (PLCC), RS = Shrink Small Outline Package (SSOP).
©1994–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00026-0-5/10(B)
Rev. B | Page 20 of 20
ADI [ ADI ]
