ADG408/ADG409
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Rating
VDD to VSS
44 V
VDD to GND
VSS to GND
−0.3 V to +32 V
+0.3 V to −32 V
Analog, Digital Inputs
VSS − 2 V to VDD + 2 V or 20 mA,
whichever occurs first
Continuous Current, S or D
Peak Current, S or D
20 mA
(Pulsed at 1 ms, 10% Duty Cycle
Maximum)
40 mA
ESD CAUTION
Operating Temperature Range
Industrial (B Version)
Extended (T Version)
Storage Temperature Range
Junction Temperature
−40° C to +85°C
−55° C to +125°C
−65° C to +150°C
150°C
CERDIP Package, Power Dissipation 900 mW
θJA, Thermal Impedance
Lead Temperature, Soldering
(10 sec)
76°C/W
300°C
PDIP Package, Power Dissipation
θJA, Thermal Impedance
Lead Temperature, Soldering
(10 sec)
470 mW
117°C/W
260°C
TSSOP Package, Power Dissipation
θJA, Thermal Impedance
θJC, Thermal Impedance
SOIC Package, Power Dissipation
θJA, Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
450 mW
155°C/W
50°C/W
600 mW
77°C/W
215°C
220°C
Infrared (15 sec)
Rev. C | Page 6 of 16
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