ADG408/ADG409
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter
V
DD
to V
SS
V
DD
to GND
V
SS
to GND
Analog, Digital Inputs
Continuous Current, S or D
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle
Maximum)
Operating Temperature Range
Industrial (B Version)
Extended (T Version)
Storage Temperature Range
Junction Temperature
CERDIP Package, Power Dissipation
θ
JA
, Thermal Impedance
Lead Temperature, Soldering
(10 sec)
PDIP Package, Power Dissipation
θ
JA,
Thermal Impedance
Lead Temperature, Soldering
(10 sec)
TSSOP Package, Power Dissipation
θ
JA
, Thermal Impedance
θ
JC
, Thermal Impedance
SOIC Package, Power Dissipation
θ
JA
, Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
Rating
44 V
−0.3 V to +32 V
+0.3 V to −32 V
V
SS
− 2 V to V
DD
+ 2 V or 20 mA,
whichever occurs first
20 mA
40 mA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
−40° C to +85°C
−55° C to +125°C
−65° C to +150°C
150°C
900 mW
76°C/W
300°C
470 mW
117°C/W
260°C
450 mW
155°C/W
50°C/W
600 mW
77°C/W
215°C
220°C
Rev. C | Page 6 of 16
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