ADF4001
TIMING CHARACTERISTICS
(AV
Parameter
t
1
t
2
t
3
t
4
t
5
t
6
DV
DD
= 3 V 10%, 5 V
4.7 k ; T
A
= T
MIN
to T
MAX
unless otherwise noted; dBm referred to 50 .)
Limit at
T
MIN
to T
MAX
(B Version)
10
10
25
25
10
20
DD
=
10%; AV
DD
≤
V
P
≤
6.0 V ; AGND = DGND = CPGND= 0 V; R
SET
=
Unit
ns min
ns min
ns min
ns min
ns min
ns min
Test Conditions/Comments
DATA to CLOCK Set Up Time
DATA to CLOCK Hold Time
CLOCK High Duration
CLOCK Low Duration
CLOCK to LE Set Up Time
LE Pulsewidth
NOTES
Guaranteed by design but not production tested.
Specifications subject to change without notice.
t
3
CLOCK
t
4
t
1
DATA
DB20
(MSB)
DB19
t
2
DB2
DB1
(CONTROL BIT C2)
DB0 (LSB)
(CONTROL BIT C1)
t
6
LE
t
5
LE
Figure 1. Timing Diagram
ABSOLUTE MAXIMUM RATINGS
1, 2
(
T
A
= 25°C unless otherwise noted)
AV
DD
to GND
3
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . . . . 0 V to + 0.3 V
V
P
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
P
to AV
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
Digital I/O Voltage to GND . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Analog I/O Voltage to GND . . . . . . . . . . –0.3 V to V
P
+ 0.3 V
REF
IN
, RF
IN
A, RF
IN
B to GND . . . . . . . –0.3 V to V
DD
+ 0.3 V
RF
INA
to RF
INB
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
320 mV
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . 150°C
TSSOP
θ
JA
Thermal Impedance . . . . . . . . . . . . . . 150.4°C/W
CSP
θ
JA
Thermal Impedance (Paddle Soldered) . . . . 122°C/W
CSP
θ
JA
Thermal Impedance (Paddle Not Soldered) . . 216°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
This device is a high-performance RF integrated circuit with an ESD rating of
< 2 kΩ and it is ESD sensitive. Proper precautions should be taken for handling
and assembly.
3
GND = AGND = DGND = 0 V.
ORDERING GUIDE
Model
ADF4001BRU
ADF4001BCP
Temperature Range
–40°C to +85°C
–40°C to +85°C
Package Description
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package*
Package Option
RU-16
CP-20
*Contact
factory for chip availability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADF4001 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. 0
–3–
AD [ ANALOG DEVICES ]
