AD9631/AD9632
ABSOLUTE MAXIMUM RATINGS
1
MAXIMUM POWER DISSIPATION
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Voltage Swing
×
Bandwidth Product . . . . . . . . . . 550 V
×
MHz
Internal Power Dissipation
2
Plastic Package (N) . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Watts
Small Outline Package (R) . . . . . . . . . . . . . . . . . . . 0.9 Watts
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .
±
V
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . .
±
1.2 V
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range N, R . . . . . . . . . –65°C to +125°C
Operating Temperature Range (A Grade) . . . –40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C
NOTES
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only, and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
8-Pin Plastic Package:
θ
JA
= 90°C/Watt
8-Pin SOIC Package:
θ
JA
= 140°C/Watt
1
The maximum power that can be safely dissipated by these de-
vices is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsu-
lated devices is determined by the glass transition temperature
of the plastic, approximately +150°C. Exceeding this limit tem-
porarily may cause a shift in parametric performance due to a
change in the stresses exerted on the die by the package. Exceed-
ing a junction temperature of +175°C for an extended period can
result in device failure.
While the AD9631 and AD9632 are internally short circuit pro-
tected, this may not be sufficient to guarantee that the maxi-
mum junction temperature (+150°C) is not exceeded under all
conditions. To ensure proper operation, it is necessary to ob-
serve the maximum power derating curves.
2.0
MAXIMUM POWER DISSIPATION – Watts
8-PIN MINI-DIP PACKAGE
T
J
= +150
°
C
1.5
METALIZATION PHOTO
Dimensions shown in inches and (mm).
Connect Substrate to –V
S
.
–IN
2
+V
S
7
1.0
8-PIN SOIC PACKAGE
0.5
0.046
(1.17)
0
–50 –40 –30 –20 –10
0 10 20 30 40 50 60
AMBIENT TEMPERATURE –
°
C
6
OUT
70
80 90
Figure 2. Plot of Maximum Power Dissipation vs.
Temperature
ORDERING GUIDE
3
+IN
4
–V
S
0.050 (1.27)
AD9631
–IN
2
+V
S
7
Model
AD9631AN
AD9631AR
AD9631(SMD)
AD9631-EB
Temperature
Range
Package
Package
Description Option*
N-8
R-8
Q-8
0.046
(1.17)
6
OUT
AD9632AN
AD9632AR
AD9632-EB
–40C to +85°C
Plastic DIP
–40°C to +85°C SOIC
–55°C to +125°C Cerdip
Evaluation
Board
–40°C to +85°C Plastic DIP
–40°C to +85°C SOIC
Evaluation
Board
N-8
R-8
*N = Plastic DIP; Q = Cerdip; R= SOIC (Small Outline Integrated Circuit).
3
+IN
4
–V
S
0.050 (1.27)
AD9632
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. A
–3–
AD [ ANALOG DEVICES ]
