AD8615/AD8616/AD8618
ABSOLUTE MAXIMUM RATINGS
Table 3.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is specified
for a device soldered in a circuit board for surface-mount packages.
Parameter
Rating
Supply Voltage
6 V
Input Voltage
GND to VS
3 V
Indefinite
−65°C to +150°C
−40°C to +125°C
300°C
Table 4.
Package Type
Differential Input Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 60 sec)
Junction Temperature
θJA
θJC
61
45
43
36
35
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
5-Lead TSOT-23 (UJ)
8-Lead MSOP (RM)
8-Lead SOIC (R)
14-Lead SOIC (R)
14-Lead TSSOP (RU)
207
210
158
120
180
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. E | Page 5 of 20
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