AD8605/AD8606/AD8608
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
All Packages
Operating Temperature Range
All Packages
Junction Temperature Range
All Packages
Lead Temperature (Soldering, 60 sec)
Rating
6V
GND to V
S
6V
Observe Derating Curves
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
Table 4.
Package Type
5-Ball WLCSP (CB)
5-Lead SOT-23 (RJ)
8-Ball WLCSP (CB)
8-Lead MSOP (RM)
8-Lead SOIC_N (R)
14-Lead SOIC_N (R)
14-Lead TSSOP (RU)
1
θ
JA1
170
240
115
206
157
105
148
θ
JC
92
44
56
36
23
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
θ
JA
is specified for the worst-case conditions, that is, a device soldered in a
circuit board for surface-mount packages.
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. H | Page 8 of 24
AD [ ANALOG DEVICES ]
