AD8601/AD8602/AD8604
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature Range (Soldering, 60 sec)
ESD
Rating
6V
GND to V
S
±6 V
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
2 kV HBM
THERMAL RESISTANCE
θ
JA
is specified for worst-case conditions, that is, a device
soldered onto a circuit board for surface-mount packages using
a standard 4-layer board.
Table 4. Thermal Resistance
Package Type
5-Lead SOT-23 (RJ)
8-Lead SOIC (R)
8-Lead MSOP (RM)
14-Lead SOIC (R)
14-Lead TSSOP (RU)
16-Lead QSOP (RQ)
θ
JA
190
120
142
115
112
115
θ
JC
92
45
45
36
35
36
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. G | Page 5 of 24
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