AD8363
Preliminary Technical Data
OUTLINE DIMENSIONS
4.00
0.60 MAX
16
BSC SQ
PIN 1
INDICATOR
0.60 MAX
0.65 BSC
13
12
1
PIN 1
INDICATOR
2.25
2.10 SQ
1.95
TOP
VIEW
EXPOSED
3.75
BSC SQ
PAD
(BOTTOM VIEW)
0.75
0.60
0.50
4
9
8
5
0.25 MIN
1.95 BSC
0.80 MAX
0.65 TYP
12° MAX
0.05 MAX
0.02 NOM
1.00
0.85
0.80
0.30
0.23
0.18
0.20 REF
COPLANARITY
0.08
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
ORDERING GUIDE
Model
Temperature Range Package Description
Package Option Ordering Quantity
40°C to +125°C
1500
AD8363ACPZ-R7
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4
Evaluation Board
AD8363ACPZ-R2
40°C to +125°C
250
64
AD8363ACPZ-WP 40°C to +125°C
AD8363-EVALZ
Rev. A | Page 14 of 14
PR07368-0-8/08(PrB)
ADI [ ADI ]
