AD8315
4
3
4
3
–30ꢂC
–30ꢂC
2
2
1
1
0
0
–1
–2
–3
–4
–1
–2
–3
–4
+85ꢂC
+85ꢂC
ERROR AT +85ꢂC AND –30ꢂC
ERROR AT +85ꢂC AND –30ꢂC
BASED ON DEVIATION FROM
BASED ON DEVIATION FROM
SLOPE AND INTERCEPT AT +25ꢂC
SLOPE AND INTERCEPT AT +25ꢂC
–80
–70
–60
RF INPUT AMPLITUDE – dBV
(–47dBm)
–50
–40
–30
–20
–10
0
–80
–70
–60
RF INPUT AMPLITUDE – dBV
(–47dBm)
–50
–40
–30
–20
–10
0
(+3dBm)
(+3dBm)
TPC 7. Distribution of Error at Temperature after Ambient
Normalization vs. Input Amplitude, 3 Sigma to Either Side
of Mean, 0.1 GHz
TPC 10. Distribution of Error at Temperature after Ambient
Normalization vs. Input Amplitude, 3 Sigma to Either Side of
Mean, 1.9 GHz
4
4
3
3
–30ꢂC
ꢄ30ꢂC
2
1
2
1
0
0
–1
–1
ꢅ85ꢂC
–2
–2
+85ꢂC
ERROR AT +85ꢂC AND –30ꢂC
ERROR AT +85ꢂC AND –30ꢂC
BASED ON DEVIATION FROM
SLOPE AND INTERCEPT AT +25ꢂC
–3
–3
BASED ON DEVIATION FROM
SLOPE AND INTERCEPT AT +25ꢂC
–4
–4
–80
–70
–60
RF INPUT AMPLITUDE – dBV
(–47dBm)
–50
–40
–30
–20
–10
0
–80
–70
–60
RF INPUT AMPLITUDE – dBV
(–47dBm)
–50
–40
–30
–20
–10
0
(+3dBm)
(+3dBm)
TPC 8. Distribution of Error at Temperature after Ambient
Normalization vs. Input Amplitude, 3 Sigma to Either Side
of Mean, 0.9 GHz
TPC 11. Distribution of Error at Temperature after Ambient
Normalization vs. Input Amplitude, 3 Sigma to Either Side of
Mean, 2.5 GHz
0
3000
2700
2400
2100
1800
1500
1200
900
600
300
0
10
8
–200
–400
–600
–800
–1000
–1200
–1400
–1600
–1800
–2000
Chip Scale (LFCSP)
FREQUENCY MSOP
R
– jXꢀ
(GHz)
0.1
R – jXꢀ
2900 – j1900
700 – j240
130 – j80
2700 – j1500
730 – j220
460 – j130
440 – j110
0.9
6
4
1.9
X (LFCSP)
170 – j70
2.5
R
X
DECREASING
INCREASING
ENBL
X (MSOP)
V
V
ENBL
R (LFCSP)
2
0
R (MSOP)
1.3
1.4
1.5
1.6
1.7
0
0.5
1
1.5
2
2.5
V
– V
FREQUENCY – GHz
ENBL
TPC 9. Input Impedance
TPC 12. Supply Current vs. VENBL
–5–
REV. B
ADI [ ADI ]
