AD8315
OUTLINE DIMENSIONS
8-Lead microSOIC Package [MSOP]
(RM-8)
Dimensions shown in millimeters
3.00
BSC
8
5
4
4.90
BSC
3.00
BSC
1
PIN 1
0.65 BSC
1.10 MAX
0.15
0.00
0.80
0.40
8ꢂ
0ꢂ
0.38
0.22
0.23
0.08
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187AA
8-Lead Lead Frame Chip Scale Package [LFCSP]
2 mm ꢆ 3 mm Body
(CP-8)
Dimensions shown in millimeters
1.89
1.74
1.59
3.25
3.00
2.75
0.55
0.40
0.30
0.60
0.45
0.30
5
4
8
2.25
2.00
1.75
BOTTOM VIEW
1.95
1.75
1.55
0.15
0.10
0.05
1
PIN 1
INDICATOR
2.95
2.75
2.55
0.25
0.20
0.15
0.50 BSC
12ꢂ
0ꢂ
1.00
0.90
0.80
1.00 MAX
0.65 NOM
0.05
0.02
0.00
0.30
0.23
0.18
SEATING
PLANE
0.20 REF
NOTES
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
2. PADDLE IS COPPER PLATED WITH LEAD FINISH.
REV. B
–17–