AD8315
4
3
2
–30 C
4
3
2
ERROR – dB
–30 C
ERROR – dB
1
0
–1
–2
–3
–4
–80
+85 C
ERROR AT +85 C AND –30 C
BASED ON DEVIATION FROM
SLOPE AND INTERCEPT AT +25 C
–70
–60
–50
–40
–30
–20
RF INPUT AMPLITUDE – dBV
(–47dBm)
–10
(+3dBm)
0
1
0
–1
–2
–3
–4
–80
+85 C
ERROR AT +85 C AND –30 C
BASED ON DEVIATION FROM
SLOPE AND INTERCEPT AT +25 C
–70
–50
–40
–30
–20
–60
RF INPUT AMPLITUDE – dBV
(–47dBm)
–10
(+3dBm)
0
TPC 7. Distribution of Error at Temperature after Ambient
Normalization vs. Input Amplitude, 3 Sigma to Either Side
of Mean, 0.1 GHz
TPC 10. Distribution of Error at Temperature after Ambient
Normalization vs. Input Amplitude, 3 Sigma to Either Side of
Mean, 1.9 GHz
4
3
2
4
3
2
ERROR – dB
30 C
–30 C
ERROR – dB
1
0
–1
–2
–3
–4
–80
85 C
ERROR AT +85 C AND –30 C
BASED ON DEVIATION FROM
SLOPE AND INTERCEPT AT +25 C
–70
–60
–50
–40
–30
–20
RF INPUT AMPLITUDE – dBV
(–47dBm)
–10
(+3dBm)
0
1
0
–1
–2
–3
–4
–80
ERROR AT +85 C AND –30 C
BASED ON DEVIATION FROM
SLOPE AND INTERCEPT AT +25 C
–70
+85 C
–50
–40
–30
–20
–60
RF INPUT AMPLITUDE – dBV
(–47dBm)
–10
(+3dBm)
0
TPC 8. Distribution of Error at Temperature after Ambient
Normalization vs. Input Amplitude, 3 Sigma to Either Side
of Mean, 0.9 GHz
TPC 11. Distribution of Error at Temperature after Ambient
Normalization vs. Input Amplitude, 3 Sigma to Either Side of
Mean, 2.5 GHz
3000
2700
2400
2100
RESISTANCE –
1800
X (LFCSP)
1500
1200
900
600
300
R (MSOP)
0
0
0.5
1
1.5
FREQUENCY – GHz
2
X (MSOP)
R (LFCSP)
0
–200
–400
FREQUENCY MSOP Chip Scale (LFCSP)
R – jX
(GHz)
R – jX
–600
2900 – j1900 2700 – j1500
0.1
700 – j240
0.9
730 – j220
–800
130 – j80
1.9
460 – j130
170 – j70
2.5
440 – j110
–1000
R
X
–1200
–1400
–1600
–1800
–2000
2.5
10
8
SUPPLY CURRENT – mA
REACTANCE –
6
4
DECREASING
V
ENBL
2
INCREASING
V
ENBL
0
1.3
1.4
1.5
V
ENBL
– V
1.6
1.7
TPC 9. Input Impedance
TPC 12. Supply Current vs. V
ENBL
REV. B
–5–
AD [ ANALOG DEVICES ]
